[China Instrument Network Instrument R&D] As one of the basic technologies of modern industry, non-destructive testing has been hailed as a “quality guard” in the industry. As early as in the Ming dynasty, the scientific and technical work “Heavenly Creation” recorded the test method for judging the internal structure of objects based on changes in sound frequency. At present, the ultrasonic detection plays an important role in the field of non-destructive testing due to its advantages of high detection sensitivity, good sound beam directivity, high detection rate of harmful defects such as cracks, and wide applicability.

Recently, Wang Chong et al., Center for Ultrasound Technology, Institute of Acoustics, Chinese Academy of Sciences, has developed a fully parallel computing architecture based on a Field Programmable Gate Array (FPGA) to effectively accelerate the Total Focusing Method (TFM). Imaging, real-time imaging of non-destructive testing, can be widely used in industrial testing.
Full focus detection is a post-processing imaging method based on full ultrasound data acquisition. In each imaging position, complete detection information is used for focusing imaging. The detection resolution and sensitivity are significantly higher than that of conventional phased array detection technology. It is called “gold”. law". Due to the large amount of data and the large amount of computation, it has been impossible to apply real-time imaging to all-focus detection for a long time, making it difficult to apply to actual industrial inspection. Scholars at home and abroad have used the Graphic Processing Unit (GPU) and other computing platforms to accelerate the TFM algorithm, but subject to transmission time consumption and platform parallelism, real-time TFM imaging can not meet the detection requirements.
Based on this, Acoustics and NDT of the Institute of Acoustics Institute detected acoustics and NDT. The research team developed a phased array inspection system. Field programmable gate arrays were used. A parallel computing architecture was specifically designed for the TFM algorithm. DSP resources inside the FPGA chip were used to calculate the results. Real-time digital signal processing. The computing architecture can synthesize multiple TFM pixels independently in parallel, which greatly improves the imaging computational efficiency and at the same time ensures the imaging quality. The entire TFM algorithm can be completely calculated within the FPGA architecture. Finally, only the imaging results are transmitted to the display software, and image observation, analysis and diagnosis can be performed. Under the same detection conditions, the FPGA-based parallel computing platform improves the TFM calculation efficiency by 4.3 times compared to the existing TFM calculation programs at home and abroad, and at the same time greatly reduces the complexity of the TFM imaging system, software calculation pressure, and bandwidth transmission. Demand. The verification experiment uses the cross-hole in the steel as the simulation defect. The experimental results show that the TFM algorithm based on FPGA can achieve good imaging of the through-hole, and the imaging efficiency can reach 312.5Hz. When the imaging area is increased and the number of imaging pixels is increased, the calculation efficiency remains stable and has good robustness and practicality.
The research results have changed the traditional imaging calculation methods, fully utilized the advantages of the currently-developed programmable integrated circuits, and no longer require the processor to perform arduous superposition operations, which significantly improves the computational efficiency of TFM imaging and is conducive to the promotion of ultrasound full-focus detection. Applied to industrial sites to meet the needs of high-resolution, fast automated testing of modern industrial NDT.
Relevant research results were published in "International Acoustics and Vibration" and have applied for related patents.
(Original title: Acoustics developed a phased array inspection system)

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